METHOD FOR REAR POINT CONTACT FABRICATION FOR SOLAR CELLS
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United States of America Patent
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Issued Date -
Nov 22, 2012
app pub date -
May 16, 2012
filing date -
May 17, 2011
priority date (Note) -
Abandoned
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Abstract
A method for forming holes in the backside dielectric layer of solar cells for fabrication of rear point contact. The backside dielectric layer is coated with a layer of carbon. A shadow mask is placed over the carbon layer and reactive ion etch (RIE) is used to transfer the holes in the shadow mask to the carbon layer, to thereby form a carbon mask. The shadow mask is then removed and RIE is used to transfer the holes from the carbon mask to the dielectric layer. The carbon mask is then removed by, e.g., ashing.
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