FIXED-ARRAY ANISOTROPIC CONDUCTIVE FILM USING SURFACE MODIFIED CONDUCTIVE PARTICLES
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United States of America Patent
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Issued Date -
Nov 22, 2012
app pub date -
May 19, 2011
filing date -
May 19, 2011
priority date (Note) -
Abandoned
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Abstract
Structures and manufacturing processes of an ACF array and more particularly a non-random array of microcavities of predetermined configuration, shape and dimension. The manufacturing process includes fluidic filling of conductive particles surface-treated with a coupling agent onto a substrate or carrier web comprising a predetermined array of microcavities. The thus prepared filled conductive microcavity array is then over-coated or laminated with an adhesive film, the conductive particles are transferred to the adhesive film such that they are only partially embedded in the film.
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