ELECTROLESS PLATING APPARATUS, METHOD OF ELECTROLESS PLATING, AND MANUFACTURING METHOD OF PRINTED CIRCUIT BOARD
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
Nov 22, 2012
app pub date -
May 2, 2012
filing date -
May 19, 2011
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
An electroless plating solution is accommodated in a plating tank of an electroless plating apparatus. A reference electrode and a counter electrode are immersed in the electroless plating solution. A conductive member is provided to be electrically in contact with a conductive portion of a long-sized substrate. The conductive member, the reference electrode, and the counter electrode are connected to a potentiostat. A main control device controls the potential of the conductive portion of the long-sized substrate by a potentiostat such that the potential of the conductive portion of the long-sized substrate with respect to a potential of the reference electrode is equal to a potential of the independent portion of the long-sized substrate with respect to the potential of the reference electrode.
First Claim
Other Claims data not available