Backlight Module with Three-Dimensional Circuit Structure and Extrusion Housing
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United States of America Patent
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Issued Date -
Nov 22, 2012
app pub date -
May 18, 2011
filing date -
May 18, 2011
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
The present invention relates to a backlight module with three-dimensional circuit structure and extrusion housing, comprising: an extrusion housing, a three-dimensional circuit layer, a plurality of light-emitting devices, a reflective layer, a light guide plate, and a thermal conductive layer, wherein an installation portion of the extrusion housing has a plurality of concave holes in the first surface thereof, and the three-dimensional circuit layer is disposed on the first surface of the installation portion, the side walls of the plurality of concave holes, and the bottoms of the concave holes; Thus, the complete circuit can be disposed in the limited-sized installation portion; Moreover, moreover, the three-dimensional circuit layer further has a plurality of welding points disposed on the bottoms of the concave holes, such that the light-emitting devices can be respectively disposed in the concave holes by way of being welded on the welding points; So that, when the liquid crystal display device is hit, the extrusion housing may protect the light-emitting devices from damage.
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