Backlight Module with Three-Dimensional Circuit Structure
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United States of America Patent
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Issued Date -
Nov 22, 2012
app pub date -
May 18, 2011
filing date -
May 18, 2011
priority date (Note) -
Abandoned
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Abstract
The present invention relates to a backlight module with three-dimensional circuit structure, comprising: a housing, a thermal conductive material, a three- dimensional circuit module, a plurality of light-emitting devices, a reflective layer, a light guide plate, and a thermal conductive layer, wherein a main body of the three- dimensional circuit module has a plurality of concave holes in the surface thereof, and a three-dimensional circuit layer is disposed on the surface of the main body, the side walls of the plurality of concave holes, and the bottoms of the concave holes; in addition, the light-emitting devices are respectively disposed in the concave holes by way of being welded on the welding points; Therefore, the complete circuit can be disposed in the limit-sized main body, so that, the backlight module with three-dimensional circuit structure can be applied to a thin liquid crystal display device.
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