SYSTEMS AND METHODS FOR FACILITATING LIFT-OFF PROCESSES

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United States of America Patent

APP PUB NO 20120293474A1
SERIAL NO

13233667

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Abstract

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Systems and methods for facilitating lift-off processes are provided. In one embodiment, a method for pattering a thin film on a substrate comprises: depositing a first sacrificial layer of photoresist material onto a substrate such that one or more regions of the substrate are exposed through the first sacrificial layer; depositing a protective layer over at least part of the first sacrificial layer; partially removing the first sacrificial layer to form at least one gap between the protective layer and the substrate; depositing an optical coating over the protective layer and the one or more regions of the substrate exposed through the first sacrificial layer, wherein the optical coating deposited over the protective layer is separated by the at least one gap from the optical coating deposited over the regions of the substrate exposed through the first sacrificial layer; and removing the first sacrificial layer.

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Patent Owner(s)

Patent OwnerAddress
INTERSIL AMERICAS INC1001 MURPHY RANCH ROAD MILPITAS CA 95035

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hebert, Francois San Mateo, US 187 3281
Jerome, Rick Carlton Indialantic, US 7 20
Sun, I-Shan San Jose, US 6 35

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