Chip stacking
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United States of America Patent
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N/A
Issued Date -
Nov 22, 2012
app pub date -
May 18, 2012
filing date -
May 19, 2011
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
Methods and systems are provided to utilize and manufacture a stacked chip assembly. Microelectronic or optoelectronic chips of any dimensions are directly stacked onto each other. The chips can be of substantially identical sizes. To enable forming the stacked chip assembly, trenches are laser micro-machined onto the bottom surface of a chip to accommodate the bond wedge/ball and wire path of the chip beneath it. Consequently, chips can be tightly integrated without a gap and without having to reserve space for the bond wedges/balls.
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