METHOD OF MANUFACTURING CIRCUIT BOARD AND CIRCUIT BOARD MANUFACTURED BY THE METHOD
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United States of America Patent
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Issued Date -
Nov 22, 2012
app pub date -
Jan 4, 2012
filing date -
May 19, 2011
priority date (Note) -
Abandoned
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Abstract
A method of manufacturing a circuit board includes: providing a base substrate that comprises a first electrically conductive layer that has an inner circuit pattern formed on at least one surface of the base substrate; attaching a build-up material to the base substrate to insulate the first electrically conductive layer from outside; forming one or more holes at one time in the build-up material attached to the base substrate; forming a stack by curing the build-up material in which the one or more holes are formed; and forming a second electrically conductive layer that has an outer circuit pattern formed on at least one outer surface of the stack. The method may form the holes without drilling.
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