LARGE AREA ICP SOURCE FOR PLASMA APPLICATION
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United States of America Patent
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Issued Date -
Nov 22, 2012
app pub date -
May 16, 2012
filing date -
May 17, 2011
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
An arrangement for coupling RF energy for inductively coupled plasma chamber. The RF coil or radiator is embedded within a groove made in the ceiling of the chamber and an insulating filler covers the coil within the groove. The ceiling may be made of two plates: an upper plate made of conductive material and a bottom plate made of dielectric material. The two plates are in physical contact. A magnetic shield may be provided over the coil to control the spread of the magnetic field from the coil. Fluid channels may be made in the conductive plate to provide thermal control. Also, fluid conduits may be provided to allow injecting gas into the pace between the metal and dielectric plates.
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