SOLDER PASTE
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United States of America Patent
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N/A
Issued Date -
Nov 22, 2012
app pub date -
Dec 6, 2010
filing date -
Dec 8, 2009
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A solder paste according to an aspect of the invention includes, within a flux, an activator that has a dibasic acid with a molecular weight of 250 or less, a monobasic acid with a molecular weight of 150 or greater and 300 or less, and a dibasic acid with a molecular weight of 300 or greater and 600 or less; and at least one resin additive selected from the group consisting of high-density polyethylenes and polypropylenes. The solder paste has the resin additive in an amount of 4% by weight or greater and 12% by weight or less when the total amount of the flux is taken as 100% by weight, and has a viscosity of 400 Pa·s or greater at 80° C.
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