CLEAR LAYER ISOLATION
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United States of America Patent
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Issued Date -
Nov 15, 2012
app pub date -
Sep 20, 2011
filing date -
May 13, 2011
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A method for optical isolation in a clear mold package is provided. The method comprises forming a substrate and mounting a first component on the substrate. The method also comprises depositing a clear layer over the first component and the substrate and fabricating a trench in the clear layer near the first component, wherein the trench extends from a top surface of the substrate to the top surface of the clear layer. Further, the method comprises depositing an opaque material within the trench.
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