REDUCED RESIDUAL FORMATION IN ETCHED MULTI-LAYER STACKS

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United States of America Patent

SERIAL NO

13546622

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Abstract

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A multi-layer stack for imprint lithography is formed by applying a first polymerizable composition to a substrate, polymerizing the first polymerizable composition to form a first polymerized layer, applying a second polymerizable composition to the first polymerized layer, and polymerizing the second polymerizable composition to form a second polymerized layer on the first polymerized layer. The first polymerizable composition includes a polymerizable component with a glass transition temperature less than about 25° C., and the first polymerized layer is substantially impermeable to the second polymerizable composition.

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CITIBANK N A388 GREENWICH STREET NEW YORK NY 10013

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Brooks, Cynthia B Austin, US 12 355
LaBrake, Dwayne L Cedar Park, US 41 653
Lentz, David J Leander, US 71 6043
Liu, Weijun Cedar Park, US 78 565
Xu, Frank Y Round Rock, US 174 2481

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