INFRARED INSPECTION OF BONDED SUBSTRATES

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United States of America Patent

APP PUB NO 20120287263A1
SERIAL NO

13510135

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Abstract

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A method and apparatus for obtaining inspection information is described. A standard CCD or CMOS camera is used to obtain images in the near infrared region. Background and noise components of the obtained image are removed and the signal to noise ratio is increased to provide information that is suitable for use in inspection.

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Patent Owner(s)

Patent OwnerAddress
RUDOLPH TECHNOLOGIES INCONE RUDOLPH ROAD FLANDERS NJ 07836

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Zhou, Wei Minnetonka, US 770 4458

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