Micro-scale system to provide thermal isolation and electrical communication between substrates
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United States of America Patent
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Jun 4, 2013
Grant Date -
Nov 15, 2012
app pub date -
May 11, 2011
filing date -
May 11, 2011
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Abstract
A microscale apparatus includes a microscale rigidized Parylene strap having a reinforcement structure extending from a first side of the strap, a first silicon substrate suspended by the microscale rigidized Parylene strap, the microscale rigidized Parylene strap conformally coupled to the first substrate, and a second substrate conformally coupled to the microscale rigidized Parylene strap to suspend the first silicon substrate through the microscale rigidized Parylene strap.
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