SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE

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United States of America Patent

SERIAL NO

13398224

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Abstract

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The invention concerns a semiconductor device comprising a structure, wherein the structure comprising a substrate, a first layer onto the substrate comprising GaN and a second layer comprising AlGaN. The second layer is deposited onto the first layer and the first and the second layer cover at least partially the substrate, and wherein the structure comprises a third layer comprising diamond

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Patent Owner(s)

Patent OwnerAddress
UNIVERSITAT ULMULM GERMANY ULM BADEN-WURTTEMBERG

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Dipalo, Michele Neu-Ulm, DE 6 27
Kohn, Erhard Ulm, DE 23 197

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