WIRE SOLDER, METHOD OF FEEDING THE SAME AND APPARATUS THEREFOR
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United States of America Patent
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app pub date -
May 11, 2012
filing date -
Jan 19, 2009
priority date (Note) -
Abandoned
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Abstract
Provided is a solder with high tensile strength and pull cut resistance. The wire solder has an extended wire solder and a core wire having a higher tensile strength than the wire solder. The wire solder has a single or multiple strands bound together. The wire solder is supplied from upstream of a location of soldering while the core wire is rewound under tension at a location downstream of the location of soldering.
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