Metallized Films Having Improved Adhesion, Articles Made Therefrom, and Method Making Same
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United States of America Patent
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Issued Date -
Nov 8, 2012
app pub date -
Mar 19, 2012
filing date -
May 4, 2011
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Abandoned
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Abstract
Embodiments of the invention relate to a metallized, oriented multi-layer polymeric film having a) at least one layer A that includes a first polyolefin composition and b) a metallized layer B having a first side in surface contact with layer A, the metallized layer B includes (i) 50.0 to 99.9 wt % of a second polyolefin composition, and (ii) 0.1 to 50.0 wt % of at least one conductive polymer composition having a volume resistivity of 1.0×105 to 1.0×1012 ohm·cm (Ω·cm), based on the weight of the layer B. The film also includes a metal layer in surface contact with the metallized layer B. The films may be used as articles, particularly as flexible packaging and labels. Methods for making such films and articles are also described.
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