Mold Manufacture Method and Mold Formed by Said Method

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United States of America Patent

SERIAL NO

13536397

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Abstract

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There are provided a mold manufacture method capable of easily manufacturing a mold having a nanosized fine structure, and a mold obtained using such method. The mold manufacture method includes: a step of forming a self-assembled film 2 on an inorganic thin film 1 having the fine structure, the self-assembled film 2 being composed of a silane coupling agent having a functional group including at least one of an amino group, a mercapto group, a thiol group, a disulfide group, a cyano group, a halogen group and a sulfonic acid group; a conductive layer formation step of forming a conductive layer 3 on the self-assembled film 2; and a step of forming a metal film 4 on the conductive layer 3 through electroplating.

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Patent Owner(s)

Patent OwnerAddress
WASEDA UNIVERSITY104 TOTSUKAMACHI 1-CHOME SHINJUKU-KU TOKYO 1698050 ?1698050

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Homma, Takayuki Tokyo, JP 25 86
Saito, Mikiko Tokyo, JP 35 153

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