In-Process Monitoring for Composite Parts Quality Control Using Piezoelectric Wafer Active Sensors (PWAS) Technologies
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United States of America Patent
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Issued Date -
Nov 8, 2012
app pub date -
May 4, 2012
filing date -
May 4, 2011
priority date (Note) -
Abandoned
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Abstract
Methods of forming a molded composite material are generally provided. A composite forming precursor (e.g., fibers and/or a resin material) can be applied onto a mold that includes a plurality of piezoelectric sensors embedded into the mold. The composite forming precursor can then be cured adjacent to the mold to form a molded composite material. During curing, the molded composite material can be monitored, using the piezoelectric sensors to detect any defects formed during curing.
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