SEMICONDUCTOR STRUCTURE WITH HEAT SPREADER AND METHOD OF ITS MANUFACTURE
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United States of America Patent
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Issued Date -
Nov 8, 2012
app pub date -
Jan 12, 2011
filing date -
Jan 12, 2010
priority date (Note) -
Abandoned
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Abstract
A semiconductor structure is provided and a method for manufacturing said structure. The semiconductor structure includes a thin film semiconductor having an active region and placed on a diamond substrate. The thin film semiconductor is preferably directly bonded to the diamond layer, or may be adhered thereto by a dielectric adhesion.
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