INTEGRATED PASSIVE COMPONENT
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United States of America Patent
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Issued Date -
Nov 8, 2012
app pub date -
May 4, 2012
filing date -
May 4, 2011
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
An integrated passive component having a semiconductor body, arranged on a metal substrate and having a first surface, and a plurality of metal surfaces formed on the surface, a passivation layer formed on the surface, an integrated circuit formed near the surface of the semiconductor body, whereby the integrated circuit is connected to metal surfaces via traces formed below the passivation layer, a part of the metal surfaces is connected to pins via bonding wires, a first part of a first coil, the part formed in part above the semiconductor body, whereby the first coil with a plurality of turns has a longitudinal axis formed substantially parallel to the surface of the semiconductor body, and a second part of the first coil is formed below the semiconductor body.
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