CIRCUIT BOARD VIAHOLES AND METHOD OF MANUFACTURING THE SAME
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United States of America Patent
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app pub date -
Jul 5, 2012
filing date -
May 16, 2008
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Abandoned
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Abstract
Provided are a circuit board with a viahole and a method of manufacturing the same. The circuit board includes: a substrate formed of an insulating material; a conductive layer disposed on the substrate; a plated layer comprising nickel and disposed on the conductive layer; and a viahole passing through the substrate, the conductive layer, and the plated layer, wherein a crystal growth direction of nickel in the plated layer is parallel to a thickness-wise direction of the substrate.
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