SYSTEMS AND METHODS FOR COOLING ELECTRONIC EQUIPMENT
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United States of America Patent
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N/A
Issued Date -
Nov 8, 2012
app pub date -
Jul 13, 2011
filing date -
Jul 13, 2010
priority date (Note) -
Abandoned
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Abstract
A system for cooling electronic equipment includes first and second heat exchangers and a condenser. The first exchanger is disposed in an airflow in thermal communication with electronic equipment and is configured to receive a cooling fluid at a first temperature. The first exchanger enables heat transfer from the airflow to the cooling fluid to heat the cooling fluid to a second temperature. The second exchanger is disposed in the airflow between the first exchanger and the electronic equipment and is configured to receive the cooling fluid at the second temperature. The second exchanger enables heat transfer from the airflow to the cooling fluid to heat the cooling fluid to a third temperature. The condenser is configured to receive the cooling fluid at the third temperature and is configured to enable heat transfer from the cooling fluid to a cooling source to cool the cooling fluid to the first temperature.
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