EPOXY COATING ON SUBSTRATE FOR DIE ATTACH
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United States of America Patent
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app pub date -
May 5, 2011
filing date -
May 5, 2011
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A system and method are disclosed for applying a die attach epoxy to substrates on a panel of substrates. The system includes a window clamp having one or more windows through which the epoxy may be applied onto the substrate panel. The size and shape of the one or more windows correspond to the size and shape of the area on the substrate to receive the die attach epoxy. Once the die attach epoxy is sprayed onto the substrate through the windows of the window clamp, the die may be affixed to the substrate and the epoxy cured in one or more curing steps. The system may further include a clean-up follower for cleaning epoxy off of the window clamp, and a window cleaning mechanism for cleaning epoxy off of the sidewalls of the windows of the window clamp.
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International Classification(s)
- C09J:ADHESIVES; ADHESIVE PROCESSES IN GENERAL
- H01L:SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICE....
- B05C:APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MAT....
- B05D:PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MAT....
- B05B:SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B32B:LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA....
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