METHOD OF FORMING A HEAT DISSIPATING STRUCTURE

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United States of America Patent

SERIAL NO

13554678

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Abstract

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A forming method for a heat dissipating structure is provided. According to the method, an extrudate is formed by extrution molding, wherein the extrudate includes protruding bending portions extending in parallel. Fins are extruded monolithically on the bending portions. One or more cut channels are formed by cutting the fins and the extrudate with a cutting tool. The cutting tool cuts the fins for forming a notch on each fin at first, and then cuts the bending portions for forming a cut-through slot on each bending portion, wherein each cut-through slot is formed for cooling air flowing through two side of the extrudate. By cutting the bending portions and the fins by the cutting tool at the same time, a large number of cut-through slots are formed in despite of the existence of the fins, and the performance of heat dissipation is enhanced.

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Patent Owner(s)

Patent OwnerAddress
MITAC TECHNOLOGY CORP4TH FLOOR NO 1 R&D 2ND ROAD HSIN-CHU SCIENCE BASED INDUSTRIAL PARK HSIN-CHU HSIEN

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Liang, Ting Wei Hsinchu, TW 2 8
Wu, Min Jui Hsinchu, TW 2 8

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