INJECTION MOLDING ASSEMBLY HAVING PROCESSING CIRCUIT
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United States of America Patent
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Issued Date -
Nov 1, 2012
app pub date -
Apr 29, 2011
filing date -
Apr 29, 2011
priority date (Note) -
Abandoned
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Abstract
There is set forth a system comprising an injection molding assembly mold and a processing circuit. The mold can have a stationary section and a moveable section. The stationary section can have a channel assembly and one or more nozzle. The processing circuit can comprise one or more processor, a communication interface, and a memory including a volatile memory and a non-volatile memory. The processing circuit can be mounted to the stationary section or the moveable section in a manner that the processing circuit can be supported in a fixed position relative to the stationary section or the moveable section. The mold can further comprise one or more sensor unit, each sensor unit including one or more sensor. The system can be configured to transmit via the communication interface at least a portion of data outputted by the one or more sensor unit responsive to a request from an external computer, a change in at least one sensor reading, expiration of a pre-defined timeout, or completion of a reading cycle of the one or more sensor unit.
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