HEAT SINK MATERIAL
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United States of America Patent
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N/A
Issued Date -
Nov 1, 2012
app pub date -
Feb 2, 2011
filing date -
Feb 4, 2010
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
To provide a heat sink material that not only is excellent in heat sink properties, but also allows molded articles of various shapes made of a variety of materials to be used as a base substrate of the heat sink material. The heat sink material is also excellent in durability when in use as a heat sink material and can be thinned, and can be conveniently utilized for semiconductor devices, particularly for cell phones, personal computers and the like. The heat sink material includes a composite electroplated film having a plated metal film as a matrix wherein diamond particles are co-deposited in the matrix in such a way that a co-deposition amount of the particles gradually changes in a thickness direction of the plated metal film.
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