LED BACKLIGHT MODULE HAVING EXTRUSION HOUSING
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United States of America Patent
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Issued Date -
Nov 1, 2012
app pub date -
Feb 1, 2012
filing date -
Apr 29, 2011
priority date (Note) -
Abandoned
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Abstract
The present invention relates to an LED backlight module having extrusion housing, comprising: an extrusion housing, a circuit layer, a thermal conductive band, an accommodating body, a plurality of LED chips, a first elastic thermal-conductive member, and second elastic thermal-conductive member, wherein the accommodating body has a plurality of through holes for receiving the LED chips, such that the LED chips disposed on the circuit layer can pass through the through holes, respectively, therefore, the LED chips accommodated in the through holes are protected from suffering the impact caused by an external force; Moreover, through the thermal conductive band, the first elastic thermal-conductive member and the second elastic thermal-conductive member, when the LED chips emit light, the heat produced by the LED chips can be effectively dissipated via “double-direction dissipation”, that is, the heat can be dissipated via the front surface and the rear surface of the circuit layer.
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