Flip-chip Mounting Structure and Flip-chip Mounting Method
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United States of America Patent
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Issued Date -
Nov 1, 2012
app pub date -
Jan 19, 2011
filing date -
Jan 25, 2010
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Abstract
When a flip-chip mounting component with an Al/Au bonding structure is exposed to high temperature, voids may be caused in the Al electrode. The generation of voids causes failed connection or failed bonding between the Al electrode and the Au bump, thereby significantly degrading the connection reliability and bonding reliability in the flip-chip mounting structure. An object of the preset invention is to provide a flip-chip mounting structure that has high connection reliability and bonding reliability without being degraded even in high temperature. In a flip-chip mounting structure for wirelessly connecting an IC chip 21 having an Al electrode 22 and a substrate 41 having an Au electrode 43, a bump 52 of Al or Al alloy is formed on the Al electrode 22 of the IC chip 21 and, via the bump 52, the Al electrode 22 of the IC chip 21 and the Au electrode 43 of the substrate 41 are bonded to each other.
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