VACUUM PALLET REFLOW
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United States of America Patent
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Issued Date -
Nov 1, 2012
app pub date -
Apr 27, 2012
filing date -
Apr 27, 2011
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A soldering device and method of soldering are disclosed. The device may include at least one soldering pallet assembly. The pallet assembly may be subjected to a first atmosphere configured within the soldering pallet assembly and a second atmosphere configured external to the pallet assembly, the second atmosphere is an ambient atmosphere. At least one solder element may be positioned within the first atmosphere, and the solder element may be configured to attach an electrical component to an integrated circuit chip that is positioned within the pallet assembly.
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