ETCHING LIQUID FOR CONDUCTIVE POLYMER, AND METHOD FOR PATTERNING CONDUCTIVE POLYMER

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United States of America Patent

SERIAL NO

13453308

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Abstract

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An etching liquid for a conductive polymer is disclosed which comprises greater than 0.5 wt % but no greater than 30 wt % of (NH4)4Ce(S04)4.

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Patent Owner(s)

Patent OwnerAddress
TOAGOSEI CO LTD1-14-1 NISHI-SHIMBASHI MINATO-KU TOKYO 1058419 ?1058419

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Fujimoto, Takahiro Tokyo, JP 39 120
IHARA, Takashi Aichi, JP 27 196

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