METAL SUBSTRATE HEATER
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United States of America Patent
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Issued Date -
Oct 25, 2012
app pub date -
Aug 26, 2010
filing date -
Aug 27, 2009
priority date (Note) -
Abandoned
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Abstract
A heating element with dimensions less than a centimetre according to an embodiment of the present invention includes a metallic substrate (1) which includes a material having a thermal conductivity greater than 5 W/m·k and an ultimate tensile strength measured at ambient temperature greater than 400 MPa and which includes a working face suitable to be placed in contact with a medium or an element to be heated, a conductive layer (3) which is supported by a face of the substrate opposite the working face and which forms a circuit comprising two power supply elements (A) linked by a thin resistive element (R) and adapted to be connected to a current source, and a dielectric layer (2) interposed between the conductive layer (3) and the metallic substrate (1).
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