ASSEMBLY OF STACKED DEVICES WITH SEMICONDUCTOR COMPONENTS
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United States of America Patent
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Issued Date -
Oct 18, 2012
app pub date -
Apr 11, 2012
filing date -
Apr 14, 2011
priority date (Note) -
Abandoned
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Abstract
A method for forming an assembly including, stacked on each other, first and second devices with semiconductor components including opposite conductive balls, this method including the steps of: a) forming, on the first device, at least one resin pattern, close to at least some of the conductive balls by a distance smaller than or equal to half the ball diameter, and of a height greater than the ball height; and b) bonding the second device to the first device, by using said at least one pattern to guide the balls of the second device towards the corresponding balls of the first device.
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