HEAT TREATMENT APPARATUS AND METHOD FOR HEATING SUBSTRATE BY IRRADIATION THEREOF WITH LIGHT

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United States of America Patent

SERIAL NO

13529027

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Abstract

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A semiconductor wafer preheated to a preheating temperature is irradiated with light from flash lamps. With the light emission from the flash lamps, a surface temperature of the semiconductor wafer is maintained at a recovery temperature during a period of 10 to 100 milliseconds to induce recovery of defects created in silicon crystals. Then, with subsequent flashing light emission from the flash lamps, the surface temperature of the semiconductor wafer will reach a processing temperature to induce activation of impurities. Increasing the surface temperature of the semiconductor wafer once to the recovery temperature and then, with the flashing light emission, to the processing temperature will also prevent cracking of the semiconductor wafer.

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Patent Owner(s)

Patent OwnerAddress
DAINIPPON SCREEN MFG CO LTDKYOTO JAPAN KYOTO

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kusuda, Tatsufumi Kyoto, JP 42 1875

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