MODULAR, DETACHABLE COMPUTE LEAF FOR USE WITH COMPUTING SYSTEM

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20120260063A1
SERIAL NO

13082599

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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A detachable, logic leaf module having dendritic projections on a surface is connected to a recessed area on the surface of a cluster interface board. The projections are used for electrically connecting the logic module device to the cluster interface board or the like, the projections on the surface of the logic leaf being flexibly and conductively wired to the receiving area on the surface of the cluster interface board. The logic leaf connector is removable without the need for solder softening thermal cycles or special tools, and permits the simple removal or replacement of an individual leaf at any time.

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Patent Owner(s)

Patent OwnerAddress
I3 ELECTRONICS INC1701 NORTH STREET ENDICOTT NY 13760

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chan, Benson Vestal, US 54 1138
Egitto, Frank D Binghamton, US 86 1287
Lin, How T Vestal, US 33 868
Markovich, Voya R Endwell, US 198 5225

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