CONDUCTIVE METAL MICRO-PILLARS FOR ENHANCED ELECTRICAL INTERCONNECTION
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United States of America Patent
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Issued Date -
Oct 11, 2012
app pub date -
Apr 8, 2011
filing date -
Apr 8, 2011
priority date (Note) -
Abandoned
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Abstract
A method of forming a circuitized substrate for use in electronic packages. A substrate layer is provided that has a copper pad on a surface. A conductive seed layer and a photoresist layer are placed on the surface. The photoresist is developed and conductive material is placed within the developed features and a second conductive material placed on the first conductive material. The photoresist and conductive seed layer are removed to leave a micro-pillar array. The joining and lamination of two circuitized substrate layers utilizes the micro-pillar array for the electrical connection of the circuitized substrate layers.
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