Method of manufacturing light-emitting device, and evaporation donor substrate
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United States of America Patent
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Sep 13, 2016
Grant Date -
Oct 4, 2012
app pub date -
Apr 9, 2012
filing date -
Oct 23, 2007
priority date (Note) -
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Abstract
The present invention relates to a donor substrate and a method of manufacturing a light-emitting device. The donor substrate includes a reflective layer including an opening portion, a light absorption layer covering the opening portion of the reflective layer over the reflective layer, a heat insulating layer including an opening portion in a position overlapped with the opening portion of the reflective layer over the light absorption layer, and a material layer including a light-emitting material covering the opening portion of the heat insulating layer over the heat insulating layer. A target substrate and the donor substrate are disposed to face each other, and an EL layer is formed over the target substrate by performing light irradiation from a rear surface of the donor substrate.
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