Method for producing bonds
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
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Nov 22, 2016
Grant Date -
Oct 4, 2012
app pub date -
Oct 5, 2010
filing date -
Oct 19, 2009
priority date (Note) -
In Force
status (Latency Note)
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Abstract
The invention relates to a method for producing a bonding of two substrates of which at least one is transparent and of which at least one has a surface having a surface energy (measured according to test method C) of 40 mN/m at maximum, comprising the use off a double-sided adhesive product having a first and a second adhesive surface, wherein the first adhesive surface is covered by a first separating layer and the second adhesive surface is covered by a second separating layer, wherein the pull-off force of the first separating layer from the first adhesive surface, AZK1, is less than the pull-off force of the second separating layer from the second adhesive surface, AZK2, and wherein the ratio of adhesion force of the fresh bond of the first adhesive surface on a surface having a surface energy (measured according to test method C) of 40 mN/m at maximum (KKfresh, measured according to test method B) to the pull-off force (measured according to test method A) of the second separating layer from the second adhesive surface, KKfresh: AZK2, equals at least 13.5, comprising the following step: (a) removing the first separating layer from the first adhesive surface and bringing the first adhesive surface into contact with the surface having a surface energy (measured according to test method C) of 40 mN/m at maximum.
First Claim
all claims..Other Claims data not available
Family
Country | kind | publication No. | Filing Date | Type | Sub-Type |
---|---|---|---|---|---|
DE | A1 | DE102009045812 | Oct 19, 2009 | Patent | Application |
Type : Patent Sub-Type : Application | |||||
DOC. LAID OPEN (FIRST PUBLICATION) | Verfahren zur Herstellung von Verklebungen | Apr 28, 2011 | |||
WO | A1 | WO2011047958 | Oct 05, 2010 | Patent | Application |
Type : Patent Sub-Type : Application | |||||
INTERNATIONAL APPLICATION PUBLISHED WITH INTERNATIONAL SEARCH REPORT | VERFAHREN ZUR HERSTELLUNG VON VERKLEBUNGEN | Apr 28, 2011 | |||
BR | A2 | BR112012009097 | Oct 05, 2010 | Patent | Application |
Type : Patent Sub-Type : Application | |||||
APPLICATION FOR A PATENT OF INVENTION / PIPELINE PATENT PUBLISHED WITHOUT SEARCH REPORT | processo para produzir colagens | May 03, 2016 | |||
JP | A | JP2013508487 | Oct 05, 2010 | Patent | Application |
Type : Patent Sub-Type : Application | |||||
Published unexamined patent application | VERFAHREN ZUR HERSTELLUNG VON VERKLEBUNGEN | Mar 07, 2013 | |||
MX | A | MX2012003824 | Oct 05, 2010 | Patent | Application |
Type : Patent Sub-Type : Application | |||||
PATENT APPLICATION | METODO PARA PRODUCIR PEGADURAS. | May 08, 2012 | |||
CN | A | CN102597143 | Oct 05, 2010 | Patent | Application |
Type : Patent Sub-Type : Application | |||||
UNEXAMINED APPLICATION FOR A PATENT FOR INV. | Method for producing bonds | Jul 18, 2012 | |||
EP | B1 | EP2491086 | Oct 05, 2010 | Patent | Grant |
Type : Patent Sub-Type : Grant | |||||
Patent | VERFAHREN ZUR HERSTELLUNG VON VERKLEBUNGEN | Jan 27, 2016 | |||
KR | B1 | KR101832480 | Oct 05, 2010 | Patent | Grant |
Type : Patent Sub-Type : Grant | |||||
PATENT SPECIFICATION | 접합을 생성시키는 방법 | Feb 26, 2018 | |||
TW | B | TWI568590 | Oct 06, 2010 | Patent | Grant |
Type : Patent Sub-Type : Grant | |||||
GRANTED PATENT OR PATENT OF ADDITION | Method for producing bonds | Feb 01, 2017 | |||
IN | A | IN2012DN02685 | Mar 28, 2012 | Patent | Grant |
Type : Patent Sub-Type : Grant | |||||
PATENT OR PATENT OF ADDITION | 'method for producing bonds' | Sep 04, 2015 |
- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
Patent Owner(s)
Patent Owner | Address | |
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TESA SE | 20253 HAMBURG |
International Classification(s)

- 2010 Application Filing Year
- C09J Class
- 414 Applications Filed
- 222 Patents Issued To-Date
- 53.63 % Issued To-Date
Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
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Dalmis, Gabriel | Hamburg, DE | 5 | 24 |
# of filed Patents : 5 Total Citations : 24 | |||
Diamantis, Niko | Bönningstedt, DE | 1 | 3 |
# of filed Patents : 1 Total Citations : 3 | |||
Dollase, Thilo | Hamburg, DE | 74 | 336 |
# of filed Patents : 74 Total Citations : 336 |
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Patent Citation Ranking
- 0 Citation Count
- C09J Class
- 0 % this patent is cited more than
- 9 Age
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Maintenance Fees
Fee | Large entity fee | small entity fee | micro entity fee | due date |
---|---|---|---|---|
11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | May 22, 2028 |
Fee | Large entity fee | small entity fee | micro entity fee |
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Surcharge - 11.5 year - Late payment within 6 months | $160.00 | $80.00 | $40.00 |
Surcharge after expiration - Late payment is unavoidable | $700.00 | $350.00 | $175.00 |
Surcharge after expiration - Late payment is unintentional | $1,640.00 | $820.00 | $410.00 |
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