DURABLE GLASS HOUSINGS/ENCLOSURES FOR ELECTRONIC DEVICES
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United States of America Patent
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Issued Date -
Oct 4, 2012
app pub date -
May 15, 2012
filing date -
Aug 21, 2008
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Abandoned
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Abstract
A housing/enclosure/cover can include an ion-exchanged glass exhibiting the following attributes (1) radio, and microwave frequency transparency, as defined by a loss tangent of less than 0.03 and at a frequency range of between 15 MHz to 3.0 GHz; (2) infrared transparency; (3) a fracture toughness of greater than 0.6 MPa·m1/2; (4) a 4-point bend strength of greater than 350 MPa; (5) a Vickers hardness of at least 450 kgf/mm2 and a Vickers median/radial crack initiation threshold of at least 5 kgf; (6) a Young's Modulus ranging between about 50 to 100 GPa;; (7) a thermal conductivity of less than 2.0 W/m° C., and (9) and at least one of the following attributes: (i) a compressive surface layer having a depth of layer (DOL) greater and a compressive stress greater than 400 MPa, or, (ii) a central tension of more than 20 MPa.
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