SOLDER PASTES FOR PROVIDING IMPACT RESISTANT, MECHANICALLY STABLE SOLDER JOINTS
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United States of America Patent
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N/A
Issued Date -
Oct 4, 2012
app pub date -
Apr 1, 2011
filing date -
Apr 1, 2011
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A solder is provided that produces a more impact resistant solder joint that is usable in high-end applications. The solder joint has a strong interconnection that can perform all of the normal functions of a solder joint while being more impact resistant. Furthermore, the solder joint retains its capabilities over the service life of a high-end product such as a computer or a cell phone. The solder meets the requirements of the soldering industry both today and into the future, including but not limited to an ability to be printed or dispensed with standard methods and conformity to health and safety standards.
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