Soldering device for forming electrical solder connections in a disk drive unit
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United States of America Patent
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Issued Date -
Oct 4, 2012
app pub date -
Jun 22, 2011
filing date -
Mar 31, 2011
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A soldering device for forming electrical solder connections in a disk drive unit comprises a nozzle device comprising at least two separated movable housings that provides a passage, the upper ends of the housings form an entrance, and the lower ends of the housings form a nozzle; and an actuating device connecting with the nozzle device and arranged for controlling the housings of the nozzle device to move together or apart, thereby controlling the inner diameter size of the nozzle. The present invention provides movable housings of the nozzle device so as to make the size of the nozzle controllable, finally benefits to perform a solder connection.
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