FLAME-RETARDANT AROMATIC POLYCARBONATE RESIN COMPOSITION
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United States of America Patent
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app pub date -
Jun 6, 2012
filing date -
Jan 9, 2007
priority date (Note) -
Abandoned
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Abstract
The present invention relates to a flame-retardant aromatic polycarbonate resin composition comprising:
- 100 parts by weight of an aromatic polycarbonate resin having an end hydroxyl group concentration of 10 to 1000 ppm; and0.001 to 0.5 parts by weight of a non-halogen-based aromatic sulfonic acid metal salt compound represented by the following general formula (1):
First Claim
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- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
Patent Owner(s)
Patent Owner | Address | |
---|---|---|
MITSUBISHI ENGINEERING-PLASTICS CORPORATION | 9-2 HIGASHI-SHINBASHI 1-CHOME MINATO-KU TOKYO 105-0021 |
International Classification(s)

- 2012 Application Filing Year
- C08L Class
- 2434 Applications Filed
- 1882 Patents Issued To-Date
- 77.33 % Issued To-Date
Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
---|---|---|---|
MONDEN, Toshiki | Kanagawa-ken, JP | 23 | 73 |
# of filed Patents : 23 Total Citations : 73 | |||
Nakano, Hiroshi | Kanagawa-ken, JP | 377 | 4094 |
# of filed Patents : 377 Total Citations : 4094 |
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Patent Citation Ranking
- 1 Citation Count
- C08L Class
- 8.18 % this patent is cited more than
- 13 Age
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Maintenance Fees
Fee | Large entity fee | small entity fee | micro entity fee | due date |
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Fee | Large entity fee | small entity fee | micro entity fee |
---|---|---|---|
Surcharge after expiration - Late payment is unavoidable | $700.00 | $350.00 | $175.00 |
Surcharge after expiration - Late payment is unintentional | $1,640.00 | $820.00 | $410.00 |
Full Text
US Patent Application No: 2017/0018,513
SEMICONDUCTOR PACKAGE INCLUDING AN ANTENNA FORMED IN A GROOVE WITHIN A SEALING ELEMENT
Abstract
There are provided a semiconductor package including an antenna formed integrally therewith, and a method of manufacturing the same. The semiconductor package includes: a semiconductor chip; a sealing part sealing the semiconductor chip; a substrate part formed on at least one surface of the sealing part; and an antenna part formed on the sealing part or the substrate part and electrically connected to the semiconductor chip.
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