METHOD FOR PRINTING A SUBSTRATE
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United States of America Patent
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Issued Date -
Sep 27, 2012
app pub date -
Nov 22, 2011
filing date -
Mar 22, 2011
priority date (Note) -
Abandoned
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Abstract
Embodiments of the present invention generally relate to methods of printing MWT solar cells. The methods include positioning the non-light-receiving side of a solar cell substrate on a support. The solar cell substrate has a plurality of holes formed therethrough. The plurality of holes are then metalized. Metalizing the holes includes applying a first silver-containing paste within the holes, or depositing the first silver-containing paste on the interior surface of the holes. The first silver-containing paste is in electrical communication with the front surface and the back surface of the substrate. Then, a plurality of collection fingers are formed on the front surface of the substrate using a second silver-containing paste. The substrate may then be flipped, and one or more printing processes may be performed on the non-light-receiving side of the substrate.
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