SYSTEM AND A METHOD FOR SOLDER MASK INSPECTION
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United States of America Patent
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Issued Date -
Sep 27, 2012
app pub date -
Jul 6, 2010
filing date -
Jul 6, 2009
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Abstract
A system and a method for method for printing a solder mask on a printed circuit board (PCB), the method includes: acquiring images of multiple areas of a PCB by an inspection unit while the PCB is supported by a mechanical stage; determining spatial differences between a model of the PCB and the PCB based on the images; determining solder mask ink deposition locations based on (i) the spatial differences, and (ii) locations of the model of the PCB that should be coated with the solder mask ink; and printing solder mask ink on the solder mask deposition locations by a printing unit, while the PCB is supported by the mechanical stage.
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