CONDUCTIVE METAL NUB FOR ENHANCED ELECTRICAL INTERCONNECTION, AND INFORMATION HANDLING SYSTEM UTILIZING SAME
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
Sep 27, 2012
app pub date -
Jan 20, 2011
filing date -
Jan 20, 2011
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A method of forming a circuitized substrate utilizing a conductive nub structure for enhanced interconnection integrity by using a joining core layer with copper outer layer on it, and forming thru-holes in the joining layer. Placing conductive adhesive in the thru-hole prior to removing the copper outer layers from the joining core layer creates an adhesive bump on joining core layer that engages a conductive secondary metal nub placed on the circuitized substrate-to-joining layer contact points, thus creating an enhanced connection between the layers.
First Claim
Family
International Classification(s)
- [Classification Symbol]
- [Patents Count]
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully