LAND GRID ARRAY (LGA) CONTACT CONNECTOR MODIFICATION
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United States of America Patent
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Issued Date -
Sep 27, 2012
app pub date -
Oct 14, 2010
filing date -
Oct 14, 2010
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Abandoned
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Abstract
A method of converting a land grid array (LGA) module to a ball grid array (BGA) module by removing and oxidizing portions of the LGA conductive pad features on the upper surface of the LGA module. A BGA solder ball is deposited on the remaining portion of the conductive feature of the LGA module, with subsequent reflowing of the BGA solder ball. By modifying the LGA module to support a BGA structure, excessive heat generated by components placed on the modified LGA pad can be conducted through the BGA structure and into the element on which the LGA module is attached, such as a PCB.
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