PRINTING CIRCUIT BOARD WITH MICRO-RADIATORS
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United States of America Patent
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Issued Date -
Sep 27, 2012
app pub date -
Jan 5, 2011
filing date -
Nov 30, 2010
priority date (Note) -
Abandoned
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Abstract
The present invention relates to a printing circuit board with micro-radiators. The printing circuit board includes a substrate, the substrate includes multi-layer copper clad plates and multi-layer prepregs, the multi-layer copper clad plates and the multi-layer prepregs are cross-laminated, the printing circuit board also includes at least one cylindrical micro-radiator embedded into a cylindrical hole of the substrate, the height of the insulating microradiator is equal to the thickness of the substrate, an upper surface and a lower surface of the micro-radiator are covered by copper foils, a heating element is installed on one of the surfaces of the insulating micro-radiator, the other surface of the insulating micro-radiator is isolated from other circuits of the printing circuit board. The present invention combines the micro-radiator with high thermal conductivity and traditional rigid printing circuit board. The present invention has the advantages of high thermal conductivity and stable heat transfer.
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