Signal routing Optimized IC package ball/pad layout
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United States of America Patent
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Issued Date -
Sep 27, 2012
app pub date -
Apr 20, 2011
filing date -
Mar 21, 2011
priority date (Note) -
Abandoned
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Abstract
This invention provides layout schemes for ball/pad regions on a printed circuit board for a small regular ball/pad region grid that provides additional space between ball/pad regions for increased wiring capability. The layout scheme is consistent with printed circuit board manufacturing requirements and minimum wiring channel requirements demanded by high density integrated circuit chips.
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