SUBSTRATE PROCESSING APPARATUS AND SOLID RAW MATERIAL REPLENISHING METHOD

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United States of America Patent

APP PUB NO 20120240858A1
SERIAL NO

13425430

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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Disclosed is a substrate processing apparatus that includes: a processing chamber that accommodates a substrate; and a raw material supply system that sublimates a solid raw material to generate a gas raw material used for processing of the substrate, and supplies the generated gas raw material to the processing chamber. The raw material supply system includes: a solid raw material container that stores the solid raw material; a first piping connected between the solid raw material container and the processing chamber; and a second piping connected with the solid raw material container and equipped with an attachment portion to which a raw material replenishing container that holds the solid raw material for replenishment is attached.

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Patent Owner(s)

Patent OwnerAddress
HITACHI KOKUSAI ELECTRIC INC15-12 NISHI-SHIMBASHI 2-CHOME MINATO-KU TOKYO 105-8039
KITZ SCT CORPORATION5-1 OHMORI-KITA 1-CHOME OHTA-KU TOKYO

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
KOYAMA, Goki Tokyo, JP 2 496
TANIYAMA, Tomoshi Toyama, JP 72 2979

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