HEAT CONDUCTIVE COMPOSITE SUBSTRATE HAVING HEAT DISSIPATION PROPERTIES AND MANUFACTURING METHOD THEREOF
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United States of America Patent
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Issued Date -
Sep 20, 2012
app pub date -
Jan 12, 2012
filing date -
Mar 17, 2011
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Abstract
The present invention discloses a heat conductive composite substrate having heat dissipation properties and a manufacturing method thereof. The heat conductive composite substrate comprises a heat dissipation substrate and a metal diamond composite layer physically disposed on the heat dissipation substrate for passing heat energy to the heat dissipation substrate. The metal diamond composite layer is a growth substance including at least one kind metal, and the growth substance is distributed with plural diamond particles therein.
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